Established · India

India's first dedicated
200mm silicon wafer
manufacturer.

Sila Semiconductors is building a precision silicon substrate facility to serve the global semiconductor supply chain — manufactured in India, for the world.

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What We Do

We make the wafer every chip begins with.

Before a chip is designed, before a fab runs a single process step — there is the wafer. Sila Semiconductors manufactures that wafer. 200mm. Polished. CZ-grade. Made in India.

01
The Product

200mm Polished Silicon Wafers

CZ-grade substrates used by semiconductor fabs worldwide to manufacture ICs for automotive, industrial, and communications applications. Delivered to exacting surface quality specifications.

02
The Process

Ingot Slicing to Mirror-Grade Finish

From incoming silicon ingot through slicing, lapping, etching and chemical-mechanical polishing, to final metrology — every wafer leaves our facility print-ready for fab use.

Why It Matters

India imports every silicon wafer it consumes.
That is about to change.

India's semiconductor ambitions rest on a supply chain that begins with silicon wafers — yet today, not a single polished wafer is manufactured domestically. The entire requirement is imported, primarily from Japan, South Korea, and Taiwan. Sila Semiconductors exists to close that gap.

$1.1B

India silicon wafer market size in 2024 — every dollar of which is currently served by imports.

7%+

Projected CAGR of India's silicon wafer market through 2033, driven by semiconductor and solar demand.

$15.9B

Global silicon wafer market in 2024, growing to $27.1B by 2031 — the addressable export opportunity.

The Facility

A purpose-built wafer manufacturing facility,
designed for scale.

Product
200mm Polished Silicon Wafers
CZ-grade, IC and power device quality
Annual Capacity
~250,000 Wafers / Year
Phase 1 nameplate capacity
Location
TBD, India
Site selection in progress
Development Roadmap
Phase 1 · Now
Ingot-to-Wafer Conversion
Slicing, lapping, etching, polishing and metrology. ~250,000 wafers/year.
Phase 2 · Future
In-House CZ Crystal Growth
Full vertical integration from polysilicon ingot to finished wafer.
Phase 3 · Aspirational
300mm Capability
Next-generation wafer size serving advanced logic and memory fabs.
Get In Touch

Investor enquiries & partnership
discussions welcome.

Whether you are an investor, a potential fab customer, or an institutional partner — we would like to hear from you.

All enquiries are treated with strict confidentiality. We will respond within 2 business days.

Thank you for reaching out.
Your enquiry has been received. We will get back to you within 2 business days.